A new chapter in Germany-Taiwan relations unfolds as a contingent of German students from Saxony is set to embark on a journey to Taiwan for specialized chip training in semiconductors next spring. This development follows closely on the heels of the Taiwan Semiconductor Manufacturing Co. (TSMC) revealing its blueprint to construct a novel fabrication unit in Dresden, Germany.
As per the agreement ratified on Tuesday, roughly 50 German students will partake in a half-year talent development initiative in Taiwan each year. Ursula Staudinger, the head of Dresden University of Technology (TU Dresden), shared this information at a gathering in Taipei.
The chosen students, hailing from TU Dresden and other academic establishments in Saxony, will enroll in semiconductor classes at a Taiwanese educational institution, such as the National Taiwan University. Subsequently, they will undertake an apprenticeship at TSMC to acquire hands-on expertise.
Staudinger emphasized that the endeavor is designed to entice German students towards the semiconductor domain and catalyze collaborative research efforts between German academies and the research and development (R&D) division of TSMC.
Lora Ho, TSMC’s senior vice president of human resources, conveyed her confidence that the students’ direct interaction with engineers would augment their comprehension of semiconductor fabrication and the intricacies of TSMC’s wafer production operations. She stated that the aspiration is to eventually dispatch 100 German students with a background in science, technology, engineering, or mathematics to Taiwan annually, courtesy of financial backing from the Saxony state administration.
This advancement trails TSMC’s declaration, a mere six weeks prior, of its aspiration to erect a 12-inch wafer factory in Dresden, joining forces with Bosch, Infineon Technologies, and NXP Semiconductors.
The proposed establishment, dedicated to the production of automotive microchips, represents a monumental investment surpassing $10.7 billion, financed via equity, loans, and patronage from the European Union and German authorities. TSMC disclosed that the groundwork is scheduled to kick off in the latter half of 2024, with the onset of production anticipated by the close of 2027.
Sebastian Gemkow, the minister of science, culture, and tourism for Saxony, highlighted the pivotal role of the freshly inaugurated ‘Saxon Science Liaison Office’ in Taipei for the successful implementation of the program. Situated within the German Trade Office (GTO) Taipei, the office will be supervised by Josef Goldberger, previously affiliated with the German Academic Exchange Service (DAAD) Taiwan office.
This collaborative endeavor marks a significant stride towards bolstering technological interchange and collaboration between Germany and Taiwan, at a time when the global semiconductor supply chain is grappling with formidable challenges.
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